Share Email Print
cover

Proceedings Paper

Assembly process issues and reliability in microsystem packaging
Author(s): Leland Spangler
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Microsystem packages and package assembly processes have an enormous influence on the ability to successfully bring a microsystem product to market. Package and assembly processes can introduce both performance and reliability issues which can introduce significant delays in the product engineering cycle. Typically, thousands of devices must be made and tested to fully quantify the reliability of a microsystem product. While most microsystem products use package and package assembly technology adapted from the integrated circuit industry, the unique aspects of these devices requires unique package designs and unique implementation of the unit assembly processes. This paper discusses many of these unit processes, their adaptation to microsystem applications and the reliability issues that can be traced back to these processes. Solutions to these package assembly issues will also be presented.

Paper Details

Date Published: 23 December 2003
PDF: 13 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.531901
Show Author Affiliations
Leland Spangler, Aspen Technologies (United States)


Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

© SPIE. Terms of Use
Back to Top