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Proceedings Paper

Laser applications in integrated circuits and photonics packaging
Author(s): Yong Feng Lu; L. P. Li; K. Mendu; J. Shi
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Paper Abstract

Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash from heat sinks and lead wires of IC packages, laser singulation of BGA (ball grid array) and CSP (chip scale packages), laser reflow of solder ball on GBA, laser peeling for CSP, laser marking on packages and on Si wafers. Laser nanoimprinting of self-assembled nanoparticles has been recently developed to fabricate hemispherical cavity arrays on semiconductor surfaces. This process has the potential applications in fabrication and packaging of photonic devices such as waveguides and optical interconnections. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to be taken into account. Monitoring of laser-induced plasma and laser induced acoustic wave has been used to understand and to control the processes involved in these applications. Numerical simulations can provide useful information on process analysis and optimization.

Paper Details

Date Published: 15 July 2004
PDF: 14 pages
Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); doi: 10.1117/12.531758
Show Author Affiliations
Yong Feng Lu, Univ. of Nebraska/Lincoln (United States)
L. P. Li, Univ. of Nebraska/Lincoln (United States)
K. Mendu, Univ. of Nebraska/Lincoln (United States)
J. Shi, Univ. of Nebraska/Lincoln (United States)


Published in SPIE Proceedings Vol. 5339:
Photon Processing in Microelectronics and Photonics III
Jan J. Dubowski; David B. Geohegan; Frank Träger; Peter R. Herman; Jim Fieret; Alberto Pique; Tatsuo Okada; Friedrich G. Bachmann; Willem Hoving; Kunihiko Washio; Xianfan Xu, Editor(s)

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