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Proceedings Paper

High-throughput scribing for the manufacture of LED components
Author(s): Dimitris Karnakis; Elizabeth K. Illy; Martyn R. H. Knowles; Erdan Gu; Martin D. Dawson
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Paper Abstract

Lasers are an important tool in the fabrication of photonic components and in particular their use in scribing for separating LED dies on sapphire substrates. This paper describes scribing and cutting of sapphire and GaN using UV lasers (355nm and 266nm harmonics of Nd:YVO4 and 255nm harmonic of CVL). Scribing of sapphire at speed of 30mm/s have been achieved and cutting of sapphire of up to 700 microns thickness has been demonstrated.

Paper Details

Date Published: 21 June 2004
PDF: 5 pages
Proc. SPIE 5366, Light-Emitting Diodes: Research, Manufacturing, and Applications VIII, (21 June 2004); doi: 10.1117/12.531685
Show Author Affiliations
Dimitris Karnakis, Oxford Lasers Ltd. (United Kingdom)
Elizabeth K. Illy, Oxford Lasers Ltd. (United Kingdom)
Martyn R. H. Knowles, Oxford Lasers Ltd. (United Kingdom)
Erdan Gu, Univ. of Strathclyde (United Kingdom)
Martin D. Dawson, Univ. of Strathclyde (United Kingdom)


Published in SPIE Proceedings Vol. 5366:
Light-Emitting Diodes: Research, Manufacturing, and Applications VIII
Steve A. Stockman; H. Walter Yao; E. Fred Schubert, Editor(s)

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