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Proceedings Paper

Reliable vacuum packaging using NanoGetters and glass frit bonding
Author(s): Douglas Sparks; Sonbol Massoud-Ansari; Nader Najafi
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Paper Abstract

A new approach to vacuum packaging micromachined resonant, tunneling, and display devices will be covered in this paper. A multi-layer, thin-film getter, called a NanoGetter, which is particle free and does not increase the chip size of the microsystem has been developed and integrated into conventional wafer-to-wafer bonding processes. Experimental data taken with chip-scale packages using glass frit bonding between the Pyrex and silicon wafers, has resulted in silicon resonators in which Q values in excess of 37,000 have been obtained. Reliability data for vacuum-sealed diaphragms and resonators will be presented. Unlike previous reliability studies without getters, no degradation in Q has been noted with NanoGetter parts after extended high temperature storage. Applications for this technology include gyroscopes, accelerometers, displays, flow sensors, density meters, IR sensors, microvacuum tubes, RF-MEMS, pressure sensors and other vacuum sealed devices.

Paper Details

Date Published: 23 December 2003
PDF: 9 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.530414
Show Author Affiliations
Douglas Sparks, ISSYS Sensing Systems, Inc. (United States)
Sonbol Massoud-Ansari, ISSYS Sensing Systems, Inc. (United States)
Nader Najafi, ISSYS Sensing Systems, Inc. (United States)


Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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