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Proceedings Paper

Optical interconnect on printed wiring board
Author(s): Mikko Karppinen; Jukka-Tapani Makinen; Kari Kataja; Antti Tanskanen; Teemu Alajoki; Pentti Karioja; Marika Immonen; Jorma Kivilahti
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Paper Abstract

Integration of high-speed parallel optical interconnects into printed wiring boards (PWB) is studied. The aim is a hybrid optical-electrical board including both electrical wiring and embedded polymer waveguides. Robust optical coupling between the waveguide and the emitter/detector should be achieved by the use of automated pick-and-place assembly. Different coupling schemes were analyzed by combining non-sequential ray tracing with Monte-Carlo tolerance simulation of misalignments. The simulations demonstrate that, with optimized optomechanical structures and with very low loss waveguides, it is possible to achieve acceptable total path loss and yield with the accuracy of automated assembly. A technical demonstrator was designed and realized to allow testing of embedded interconnects based on three different kind of optical coupling schemes: butt-coupling, and couplings based on micro-lens arrays and on micro-ball lenses. They were implemented with PIN and flip-chip-VCSEL arrays as well as 10-Gb/s/channel electronics onto LTCC-based (low-temperature co-fired ceramic) transmitter and receiver modules, which were surface mounted on high-speed PWBs. The polymer waveguides were on separate FR-4 boards to allow testing and characterization of alignment tolerances with different waveguides. With micro-lens array transmitter, the measured tolerances (±10 μm) were dominated by the thickness of the waveguides.

Paper Details

Date Published: 10 June 2004
PDF: 11 pages
Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); doi: 10.1117/12.530350
Show Author Affiliations
Mikko Karppinen, VTT Electronics (Finland)
Jukka-Tapani Makinen, VTT Electronics (Finland)
Kari Kataja, VTT Electronics (Finland)
Antti Tanskanen, VTT Electronics (Finland)
Teemu Alajoki, VTT Electronics (Finland)
Pentti Karioja, VTT Electronics (Finland)
Marika Immonen, Helsinki Univ. of Technology (Finland)
Jorma Kivilahti, Helsinki Univ. of Technology (Finland)


Published in SPIE Proceedings Vol. 5358:
Photonics Packaging and Integration IV
Randy A. Heyler; Ray T. Chen, Editor(s)

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