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Proceedings Paper

Laser microjoining of dissimilar and biocompatible materials
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Paper Abstract

Micro-joining and hermetic sealing of dissimilar and biocompatible materials is a critical issue for a broad spectrum of products such as micro-electronics, micro-optical and biomedical products and devices. Today, biocompatible titanium is widely applied as a material for orthopedic implants as well as for the encapsulation of implantable devices such as pacemakers, defibrillators, and neural stimulator devices. Laser joining is the process of choice to hermetically seal such devices. Laser joining is a contact-free process, therefore minimizing mechanical load on the parts to be joined and the controlled heat input decreases the potential for thermal damage to the highly sensitive components. Laser joining also offers flexibility, shorter processing time and higher quality. However, novel biomedical products, in particular implantable microsystems currently under development, pose new challenges to the assembly and packaging process based on the higher level of integration, the small size of the device's features, and the type of materials and material combinations. In addition to metals, devices will also include glass, ceramic and polymers as biocompatible building materials that must be reliably joined in similar and dissimilar combinations. Since adhesives often lack long-term stability or do not meet biocompatibility requirements, new joining techniques are needed to address these joining challenges. Localized laser joining provides promising developments in this area. This paper describes the latest achievements in micro-joining of metallic and non-metallic materials with laser radiation. The focus is on material combinations of metal-polymer, polymer-glass, metal-glass and metal-ceramic using CO2, Nd:YAG and diode laser radiation. The potential for applications in the biomedical sector will be demonstrated.

Paper Details

Date Published: 15 July 2004
PDF: 11 pages
Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); doi: 10.1117/12.530239
Show Author Affiliations
Ingo Bauer, Fraunhofer-Institut Lasertechnik (Germany)
Ulrich Andreas Russek, Fraunhofer-Institut Lasertechnik (Germany)
Hans J. Herfurth, Fraunhofer USA, Center for Laser Technology (United States)
Reiner Witte, Fraunhofer USA, Center for Laser Technology (United States)
Stefan Heinemann, Fraunhofer USA, Center for Laser Technology (United States)
Golam Newaz, Wayne State Univ. (United States)
A. Mian, Wayne State Univ. (United States)
D. Georgiev, Wayne State Univ. (United States)
Gregory W. Auner, Wayne State Univ. (United States)


Published in SPIE Proceedings Vol. 5339:
Photon Processing in Microelectronics and Photonics III
Jan J. Dubowski; Peter R. Herman; Friedrich G. Bachmann; Willem Hoving; Jim Fieret; David B. Geohegan; Frank Träger; Kunihiko Washio; Alberto Pique; Xianfan Xu; Tatsuo Okada, Editor(s)

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