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Proceedings Paper

MEMS components for front end of direct conversion receiver architecture
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Paper Abstract

The new MEMS technology has made a major impact on design of RF components. The results that were not possible with current IC technology are made possible with MEMS technology. Researchers are working to replace the off-chip components with on-chip components so as to achieve a single chip receiver. The high Q inductors and capacitors required for designing RF components are the bottleneck in achieving the single chip receiver. The main advantage of direct conversion architecture is fewer components are required for implementations, but there are certain design issues that must be taken care for these implementations to be successfully achieved. In this paper, MEMS components used within RF systems is analysed. The VCO is the most difficult block of RF front-end design having large impact on system performance; so stringent requirements are imposed on VCO phase noise performance. A typical range of MEMS component values are used to design and implementation the VCO.

Paper Details

Date Published: 2 April 2004
PDF: 9 pages
Proc. SPIE 5276, Device and Process Technologies for MEMS, Microelectronics, and Photonics III, (2 April 2004); doi: 10.1117/12.530186
Show Author Affiliations
Vidyadhar J. Vibhute, Victoria Univ. of Technology (Australia)
David Fitrio, Victoria Univ. of Technology (Australia)
Aleksandar Stojcevski, Victoria Univ. of Technology (Australia)
Aladin Zayegh, Victoria Univ. of Technology (Australia)
Jugdutt Singh, Victoria Univ. of Technology (Australia)


Published in SPIE Proceedings Vol. 5276:
Device and Process Technologies for MEMS, Microelectronics, and Photonics III
Jung-Chih Chiao; Alex J. Hariz; David N. Jamieson; Giacinta Parish; Vijay K. Varadan, Editor(s)

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