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Proceedings Paper

Optical I/O technology for digital VLSI
Author(s): Edris M. Mohammed; Thomas P. Thomas; Daoqiang Lu; Henning Braunisch; Steven Towle; Brandon C. Barnett; Ian A. Young; Gilroy Vandentop
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Paper Abstract

We describe the development of a high-speed, 12-channel (8-data, 2-clock and 2-alignment channels), parallel optical link with a unique packaging concept. The package is used to demonstrate the viability of chip-to-chip optical I/O in very large scale integration (VLSI) circuits. However, for implementation of optical systems in high performance computing applications, the cost of components and packaging has to come down significantly from the traditional optical communication distances. In the current work we attempted to realize such a system by using power efficient optical and electronic components together with a potentially low cost packaging solution compatible with the electronics industry. Vertical Cavity Surface Emitting Lasers (VCSEL), positive-intrinsic-negative (PIN) photodetectors, polymer waveguide arrays as well as CMOS transceiver chip were heterogeneously integrated on a standard microprocessor flip-chip pin grid array (FCPGA) substrate. The CMOS transceiver chip from 0.18μm processing technology contains VCSEL drivers, transimpedance and limiting amplifiers and on-chip self-testing circuits. A self-test circuit in such high-speed systems will be highly beneficial to reduce the testing cost in real products. For fully assembled packages we measured a 3 Gb/s optical eye for the transmitter (24Gb/s aggregate data rate) and a transmission over the complete link was achieved at 1 Gb/s (8Gb/s aggregate data rate).

Paper Details

Date Published: 10 June 2004
PDF: 11 pages
Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); doi: 10.1117/12.530160
Show Author Affiliations
Edris M. Mohammed, Intel Corp. (United States)
Thomas P. Thomas, Intel Corp. (United States)
Daoqiang Lu, Intel Corp. (United States)
Henning Braunisch, Intel Corp. (United States)
Steven Towle, Intel Corp. (United States)
Brandon C. Barnett, Intel Corp. (United States)
Ian A. Young, Intel Corp. (United States)
Gilroy Vandentop, Intel Corp. (United States)


Published in SPIE Proceedings Vol. 5358:
Photonics Packaging and Integration IV
Randy A. Heyler; Ray T. Chen, Editor(s)

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