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Proceedings Paper

The concept of field emission devices construction on the basis of self-assembling nanostructures
Author(s): Nikolay Ivanovich Mukhurov; Sergey Aleksandrovich Zhdanok; Irina Vladimirovna Gasenkova; Fedor Vasil’evich Plevako
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Paper Abstract

Herein we are offering a concept of matrix FE devices construction based on alumina technology opportunities combined with nanocarbon diamondlike materials and classical microdisplay construction. FE matrix cathode contains a massive of spikes with the emitting part in the form of NCT grown with the help of CVD method. The function of centers is fulfilled by ends of nanospikes formed by the metallization of periodical transparent nanoporous passing in substrates from one of anodic alumina (AA) surface. Spikes are grouped in separate plaits forming periodical grid. On the backside of the grid there is a resistive layer made of thin diamondlike nanomaterial and above it there is a conductive layer on each of the spikes. Control grid is formed in the way of monolith with controlling electrode 3D substrate. Dielectrical lugs on the substrate fulfill the function of spacers 1 and with high precision they keep the distance between cathode and grid while assembling microtriode. To provide precise distance between grid and anode as spacers 2 a frame made of AA and of a certain thickness is used. Modeling of triode systems with FE and separate controlling structures made of AA showed high efficiency of such a classical construction.

Paper Details

Date Published: 30 March 2004
PDF: 4 pages
Proc. SPIE 5274, Microelectronics: Design, Technology, and Packaging, (30 March 2004); doi: 10.1117/12.529927
Show Author Affiliations
Nikolay Ivanovich Mukhurov, Institute of Electronics (Belarus)
Sergey Aleksandrovich Zhdanok, Heat and Mass Transfer Institute (Belarus)
Irina Vladimirovna Gasenkova, Institute of Electronics (Belarus)
Fedor Vasil’evich Plevako, Heat and Mass Transfer Institute (Belarus)

Published in SPIE Proceedings Vol. 5274:
Microelectronics: Design, Technology, and Packaging
Derek Abbott; Kamran Eshraghian; Charles A. Musca; Dimitris Pavlidis; Neil Weste, Editor(s)

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