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Proceedings Paper

Low profile flat pack: a high-power fiber coupled laser diode package for low-cost high-reliability applications
Author(s): Raj Singh; Trebor Heminway; Richard Krasnick; Peter Griffin; Michael Powers
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Paper Abstract

In recent years, high power diode lasers have become established in many applications like material processing, fiber laser and amplifier pumping, free space communication, direct printing and medical diagnosis and procedures. In particular, advances in laser diode packaging have resulted in devices with high wall-plug efficiency, enhanced reliability and low cost of ownership. Despite the advances of recent years, packaging, testing and reliability assurance still account for a majority of the cost of a fiber coupled laser diode. At MKPA-Panasonic, we are developing new fiber coupled laser diode package designs to enable low cost, high reliability assemblies that are amenable to high volume manufacturing. In this paper, we present a new low-profile, uncooled package for single-emitter high power laser diode packaging applications. Detailed design information, thermal modeling and reliability data for this small footprint, low profile optical flat package (OFP) with 4W output power in a 0.15NA, 100 micron core fiber is presented. The unique packaging technology resulting in good thermal and reliability performance in uncooled environments is discussed. All the assembly processes for the package are performed in a flux-free environment. The package is devoid of epoxy and can be hermetically sealed for high reliability operation. A reduced bill of materials and assembly steps result in significant cost savings. The design eliminates all non-vertical assembly processes for ease of assembly. Other features include passive die attach and integrated fiber mount. This package is specifically designed to address the fiber laser pump, industrial material processing, solid state laser pumping, printing and medical application markets.

Paper Details

Date Published: 10 June 2004
PDF: 8 pages
Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); doi: 10.1117/12.529621
Show Author Affiliations
Raj Singh, MKPA-Panasonic (United States)
Trebor Heminway, MKPA-Panasonic (United States)
Richard Krasnick, MKPA-Panasonic (United States)
Peter Griffin, MKPA-Panasonic (United States)
Michael Powers, MKPA-Panasonic (United States)

Published in SPIE Proceedings Vol. 5358:
Photonics Packaging and Integration IV
Randy A. Heyler; Ray T. Chen, Editor(s)

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