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Proceedings Paper

Radiation mode coupling between active and passive chips based on a self-formed compact polymer interconnect for single-mode chip-to-chip optoelectronic integration
Author(s): Kung-Li Deng; Min-Yi Shih; Thomas B. Gorczyca; Todd Tolliver; Renato Guida; Matthew C. Nielsen; James Loman
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Paper Abstract

Based on radiation mode coupling through a self-formed polymer waveguide extension, efficient single-mode optical coupling can be achieved between active and passive chips while relaxing the stringent positioning requirements. A 20dB improvement can be achieved according to simulation results. Single-mode waveguides have been successfully demonstrated using GE photo-definable polymer materials.

Paper Details

Date Published: 10 June 2004
PDF: 8 pages
Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); doi: 10.1117/12.529221
Show Author Affiliations
Kung-Li Deng, GE Global Research Ctr. (United States)
Min-Yi Shih, GE Global Research Ctr. (United States)
Thomas B. Gorczyca, GE Global Research Ctr. (United States)
Todd Tolliver, GE Global Research Ctr. (United States)
Renato Guida, GE Global Research Ctr. (United States)
Matthew C. Nielsen, GE Global Research Ctr. (United States)
James Loman, GE Global Research Ctr. (United States)


Published in SPIE Proceedings Vol. 5358:
Photonics Packaging and Integration IV
Randy A. Heyler; Ray T. Chen, Editor(s)

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