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Proceedings Paper

Laser micromachining in microelectronic industry by water-jet-guided laser
Author(s): Ochelio Sibailly; Frank Wagner; Bernold Richerzhagen
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Paper Abstract

The water jet guided laser technology (laser Microjet®) has been developed since 10 years now and is used for several applications in the semiconductor industry. In this unique laser cutting technique, a thin stable water jet is used as a waveguide for a high-power Nd:YAG laser, that may be frequency doubled or tripled. This presentation gives an overview of the semiconductor machining applications of this technique and relates the different applications to alternative techniques and the different functions of the water jet. The water jet cools the sample when the laser is not emitting, it expels the melt very efficiently, and it avoids that the few generated particles can attach to the wafer surface. The strengths of Laser Microjet® machining are free shape cutting and cutting of thin wafers. In free shape cutting the system leads to much better results in terms of fracture strength and process simplicity than the classical laser cutting methods. In thin wafer cutting astonishing cutting speeds are obtained at very good cut quality (200 mm/s in 50 micron thick wafers). Due to the free shape cutting possibilities drilling and slotting with aspect ratios of up to 5 is also possible resulting in the same edge quality as standard cutting.

Paper Details

Date Published: 15 July 2004
PDF: 7 pages
Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); doi: 10.1117/12.529047
Show Author Affiliations
Ochelio Sibailly, Synova SA (Switzerland)
Frank Wagner, Synova SA (Switzerland)
Bernold Richerzhagen, Synova SA (Switzerland)


Published in SPIE Proceedings Vol. 5339:
Photon Processing in Microelectronics and Photonics III
Jan J. Dubowski; Peter R. Herman; Friedrich G. Bachmann; Willem Hoving; Jim Fieret; David B. Geohegan; Frank Träger; Kunihiko Washio; Alberto Pique; Xianfan Xu; Tatsuo Okada, Editor(s)

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