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Proceedings Paper

A new sensor for trench depth monitoring: the TDM 200
Author(s): Pascal Amary; Denis Cattelan; Jean-Paul Gaston; Bernard Kaplan; Eric Teboul
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Paper Abstract

A New Polarimetric method for trench depth monitoring in micromachining applications is presented. As compared to the previous innovative and patented Twin-Spot interferometric technique developed by the Thin Film Division of Jobin Yvon, this new method allows an absolute and accurate trench depth monitoring suitable for Bosch process with no external triggering.

Paper Details

Date Published: 23 December 2003
PDF: 11 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.529023
Show Author Affiliations
Pascal Amary, Jobin Yvon SAS (France)
Denis Cattelan, Jobin Yvon SAS (France)
Jean-Paul Gaston, Jobin Yvon SAS (France)
Bernard Kaplan, Jobin Yvon SAS (France)
Eric Teboul, Jobin Yvon Inc. (United States)


Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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