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Proceedings Paper

Electronic packaging: new results in singulation by Laser Microjet
Author(s): Frank Wagner; Ochelio Sibailly; Bernold Richerzhagen
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Paper Abstract

Cutting electronic packages that are produced in a matrix array fashion is an important process and deals with the ready-to-use devices. Thus an increase in the singulation yield is directly correlated to an increase in benefit. Due to the usage of different substrate materials, the saws encounter big problems in terms of lifetime and constancy of cut quality in these applications. Today’s equipment manufacturers are not yet in the position to propose an adequate solution for all types of packages. Compared to classical laser cutting, the water-jet guided laser technology minimizes the heat damages in any kind of sample. This new material processing method consists in guiding a laser beam inside a hair thin, lowpressure water-jet by total internal reflection, and is applied to package singulation since two years approximately. Using a frequency doubled Nd:YAG laser guided by a water jet, an LTCC-ceramics based package is singulated according to a scribe and break process. Speeds of 2-10 mm/s are reached in the LTTC and 40 mm/s in the mold compound. The process is wear-free and provides very good edge quality of the LTCC and the mold compound as well as reliable separation of the packages.

Paper Details

Date Published: 15 July 2004
PDF: 6 pages
Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); doi: 10.1117/12.529021
Show Author Affiliations
Frank Wagner, Synova SA (Switzerland)
Ochelio Sibailly, Synova SA (Switzerland)
Bernold Richerzhagen, Synova SA (Switzerland)


Published in SPIE Proceedings Vol. 5339:
Photon Processing in Microelectronics and Photonics III
Jan J. Dubowski; Peter R. Herman; Friedrich G. Bachmann; Willem Hoving; Jim Fieret; David B. Geohegan; Frank Träger; Kunihiko Washio; Alberto Pique; Xianfan Xu; Tatsuo Okada, Editor(s)

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