Share Email Print
cover

Proceedings Paper

Optical MEMS platform for low-cost on-chip integration of planar light circuits and optical switching
Author(s): Kristine A. German; Joel Kubby; Jingkuang Chen; James Diehl; Kathleen Feinberg; Peter Gulvin; Larry Herko; Nancy Jia; Pinyen Lin; Xueyuan Liu; Jun Ma; John Meyers; Peter Nystrom; Yao Rong Wang
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Xerox Corporation has developed a technology platform for on-chip integration of latching MEMS optical waveguide switches and Planar Light Circuit (PLC) components using a Silicon On Insulator (SOI) based process. To illustrate the current state of this new technology platform, working prototypes of a Reconfigurable Optical Add/Drop Multiplexer (ROADM) and a l-router will be presented along with details of the integrated latching MEMS optical switches. On-chip integration of optical switches and PLCs can greatly reduce the size, manufacturing cost and operating cost of multi-component optical equipment. It is anticipated that low-cost, low-overhead optical network products will accelerate the migration of functions and services from high-cost long-haul markets to price sensitive markets, including networks for metropolitan areas and fiber to the home. Compared to the more common silica-on-silicon PLC technology, the high index of refraction of silicon waveguides created in the SOI device layer enables miniaturization of optical components, thereby increasing yield and decreasing cost projections. The latching SOI MEMS switches feature moving waveguides, and are advantaged across multiple attributes relative to alternative switching technologies, such as thermal optical switches and polymer switches. The SOI process employed was jointly developed under the auspice of the NIST APT program in partnership with Coventor, Corning IntelliSense Corp., and MicroScan Systems to enable fabrication of a broad range of free space and guided wave MicroOptoElectroMechanical Systems (MOEMS).

Paper Details

Date Published: 1 July 2004
PDF: 9 pages
Proc. SPIE 5357, Optoelectronic Integration on Silicon, (1 July 2004); doi: 10.1117/12.528996
Show Author Affiliations
Kristine A. German, Xerox Wilson Ctr. Research and Technology (United States)
Joel Kubby, Xerox Wilson Ctr. Research and Technology (United States)
Jingkuang Chen, Xerox Wilson Ctr. Research and Technology (United States)
James Diehl, Xerox Wilson Ctr. Research and Technology (United States)
Kathleen Feinberg, Xerox Wilson Ctr. Research and Technology (United States)
Peter Gulvin, Xerox Wilson Ctr. Research and Technology (United States)
Larry Herko, Xerox Wilson Ctr. Research and Technology (United States)
Nancy Jia, Xerox Wilson Ctr. Research and Technology (United States)
Pinyen Lin, Xerox Wilson Ctr. Research and Technology (United States)
Xueyuan Liu, Xerox Wilson Ctr. Research and Technology (United States)
Jun Ma, Xerox Wilson Ctr. Research and Technology (United States)
John Meyers, Xerox Wilson Ctr. Research and Technology (United States)
Peter Nystrom, Xerox Wilson Ctr. Research and Technology (United States)
Yao Rong Wang, Xerox Wilson Ctr. Research and Technology (United States)


Published in SPIE Proceedings Vol. 5357:
Optoelectronic Integration on Silicon
David J. Robbins; Ghassan E. Jabbour, Editor(s)

© SPIE. Terms of Use
Back to Top