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Proceedings Paper

Micromachining of carbon nanocomposites with Nd:YAG and Nd:YVO4 frequency-converted solid-state lasers
Author(s): Larry Dosser; Ken Hix; Kevin Hartke; Richard Vaia; Mingwei Li
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Paper Abstract

Carbon nanocomposites consist of thermoset and thermoplastic materials filled with carbon nano-particles (nanotubes, bucky balls, etc.). This new and innovative group of materials offers many advantages over standard polymers such as electrical/thermal conductivity and improved structural properties. In the current study, Nd:YAG and Nd:YVO4 solid-state lasers were used to micromachine carbon nanocomposite thermoplastic materials. Experimentation was completed to compare the ability to laser micromachine carbon nanomaterial, carbon black, and unfilled polyurethane. The experimentation studied the relationship between repetition rate, travel speed, and material removal rate. The processing consisted of cutting channels into the materials using an Nd:YVO4 laser at 1064, 532, and 355 nm wavelengths. The material removal rate and groove width were quantified for all wavelengths and compared versus the experimental variables. Trials were also completed on laser machining deep channels using an Nd:YAG laser and polyetheretherketone (PEEK) filled with carbon black and carbon nanofiber. The results of the experimentation show similar material removal rates for carbon black and carbon nanofiber filled polyurethane. The PEEK material exhibited high aspect ratio channels with both carbon black and carbon nanofiber fillers. Laser micromachining of polymers whcih were previously unmachinable using infra-red has been demonstrated.

Paper Details

Date Published: 15 July 2004
PDF: 8 pages
Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); doi: 10.1117/12.528338
Show Author Affiliations
Larry Dosser, Mound Laser & Photonics Ctr., Inc. (United States)
Ken Hix, Mound Laser & Photonics Ctr., Inc. (United States)
Kevin Hartke, Mound Laser & Photonics Ctr., Inc. (United States)
Richard Vaia, Air Force Research Lab. (United States)
Mingwei Li, Spectra-Physics, Inc. (United States)


Published in SPIE Proceedings Vol. 5339:
Photon Processing in Microelectronics and Photonics III
Jan J. Dubowski; Peter R. Herman; Friedrich G. Bachmann; Willem Hoving; Jim Fieret; David B. Geohegan; Frank Träger; Kunihiko Washio; Alberto Pique; Xianfan Xu; Tatsuo Okada, Editor(s)

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