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Proceedings Paper

AC-coupled interconnect for high-density high-bandwidth packaging
Author(s): Paul D Franzon; Stephen Mick; John M. Wilson; Lei Luo; Karthik Chandrasakhar
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Paper Abstract

AC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O pitches of less than 100 μm and signaling rates greater than 3 Gbps per I/O on integrated circuits, while preserving excellent signal integrity. This paper presents a summary of approaches and status capacitive and inductive versions of AC Coupled Interconnect Systems.

Paper Details

Date Published: 30 March 2004
PDF: 3 pages
Proc. SPIE 5274, Microelectronics: Design, Technology, and Packaging, (30 March 2004); doi: 10.1117/12.528076
Show Author Affiliations
Paul D Franzon, North Carolina State Univ. (United States)
Stephen Mick, North Carolina State Univ. (United States)
John M. Wilson, North Carolina State Univ. (United States)
Lei Luo, North Carolina State Univ. (United States)
Karthik Chandrasakhar, North Carolina State Univ. (United States)

Published in SPIE Proceedings Vol. 5274:
Microelectronics: Design, Technology, and Packaging
Derek Abbott; Kamran Eshraghian; Charles A. Musca; Dimitris Pavlidis; Neil Weste, Editor(s)

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