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Proceedings Paper

Simulation and characterization of silicon-based 0.5-MHz ultrasonic nozzles
Author(s): Y. L. Song; S. C. Tsai; W. J. Chen; Y. F. Chou; T. K. Tseng; C. S. Tsai
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Paper Abstract

This paper compares the simulation results with the experimental results of impedance analysis and longitudinal vibration measurement of micro-fabricated 0.5 MHz silicon-based ultrasonic nozzles. Impedance analysis serves as a good diagnostic tool for evaluation of longitudinal vibration of the nozzles. Each nozzle is made of a piezoelectric drive section and a silicon-resonator consisting of multiple Fourier horns each with half wavelength design and twice amplitude magnification. The experimental results verified the simulation prediction of one pure longitudinal vibration mode at the resonant frequency in excellent agreement with the design value. Furthermore, at the resonant frequency, the measured longitudinal vibration amplitude gain at the nozzle tip increases as the number of Fourier horns (n) increases in good agreement with the theoretical value of 2n. Using this design, very high vibration amplitude at the nozzle tip can be achieved with no reduction in the tip cross sectional area. Therefore, the required electric drive power should be drastically reduced, decreasing the likelihood of transducer failure in ultrasonic atomization.

Paper Details

Date Published: 24 January 2004
PDF: 7 pages
Proc. SPIE 5344, MEMS/MOEMS Components and Their Applications, (24 January 2004); doi: 10.1117/12.527862
Show Author Affiliations
Y. L. Song, Institute for Applied Science and Engineering Research (Taiwan)
S. C. Tsai, Institute for Applied Science and Engineering Research (Taiwan)
California State Univ./Long Beach (United States)
W. J. Chen, Institute for Applied Science and Engineering Research (Taiwan)
Y. F. Chou, National Taiwan Univ. (Taiwan)
T. K. Tseng, Institute for Applied Science and Engineering Research (Taiwan)
C. S. Tsai, Institute of Applied Science and Engineering Research (Taiwan)
Univ. of California/Irvine (United States)


Published in SPIE Proceedings Vol. 5344:
MEMS/MOEMS Components and Their Applications
Siegfried W. Janson; Albert K. Henning, Editor(s)

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