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Proceedings Paper

Versatile light-control schemes based on diffractive optics for laser drilling, cutting, and joining technologies for microelectronic and micromechanical components and devices
Author(s): Jun Amako; Tatsuya Shimoda; Kazushige Umetsu
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Paper Abstract

Indispensable in laser-processing applications is an accurate and efficient delivery of light energy to process points. For mass production, multi-beam parallel processing is a must to gain high throughput. Diffractive optics is a competitive and cost-effective solution to achieve these goals. A diffractive optical element (DOE) is able to offer various light-control functions such as focusing, splitting and shaping according to the user’s requests. These elements can be utilized in a compact and convenient optical system. Thus laser-processing technologies using diffractive optics can be easily brought into manufacturing settings. We present four laser-based processes, each of which adopts diffractive optics in a distinctive way. They are 1) laser drilling of silicon wafers using a diffractive array illuminator to form microcavities for inkjet printers, 2) laser cutting of metal films using a diffractive focusator to produce liquid-crystal display panels for mobile phones, 3) laser soldering of quartz oscillators using a diffractive beam duplicator onto printed circuits set in wristwatches, and 4) laser sealing of packages using diffraction patterns to house electronic components therein. Some of these processes are at work routinely in our manufacturing plants.

Paper Details

Date Published: 15 July 2004
PDF: 13 pages
Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); doi: 10.1117/12.527853
Show Author Affiliations
Jun Amako, Seiko Epson Corp. (Japan)
Tatsuya Shimoda, Seiko Epson Corp. (Japan)
Kazushige Umetsu, Seiko Epson Corp. (Japan)


Published in SPIE Proceedings Vol. 5339:
Photon Processing in Microelectronics and Photonics III
Jan J. Dubowski; Peter R. Herman; Friedrich G. Bachmann; Willem Hoving; Jim Fieret; David B. Geohegan; Frank Träger; Kunihiko Washio; Alberto Pique; Xianfan Xu; Tatsuo Okada, Editor(s)

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