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Proceedings Paper

Compact CWDM design and packaging
Author(s): Christine Luo; Daoyi Wang; John Kong; Lingzhi Li; Jing Li; Andrew Chang; Yao Li; Wei-shin Tsay
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Paper Abstract

In order to reduce size and cost, and at the same time increase overall performance, we designed a compact 8-ch CWDM MUX/DeMUX scheme based on free space optics. The device offers the following competitive performance specifications: IL < 0.8dB, IL ripple < 0.2dB, PDL < 0.1dB, PMD < 0.15ps, CD < 3ps/nm, IL uniformity < 0.3dB, adjacent channel isolation > 40dB, return loss > 50dB and pass-band bandwidth > 14nm. Such a device can operate in the temperature range of -10C° to 70C° with a TDL ~0.002dB/C°. In this paper, we will discuss the following three critical aspects of its design and implementation: (I) Design considerations and tolerance simulation. Here we discuss optimization of a set of critical design parameters: angle of incidence (AOI), beam size (BS), working distance (WD), filter aperture, filter orientation and filter-to-filter distance. (II) Build-in tolerance and critical alignment control. We have done extensive simulations to identify the critical variables and tolerance range for each variable. Based on this analysis, we then built in the alignment guidance and tolerances control into mechanical design. (III) Process control, material selection and surface preparation: Here we discuss the proper usage of the adhesives including the types of dual-effect adhesives, use of silica filler and coupling agent, surface preparation to achieve proper surface energy, tension and porosity, the optimum combination of the substrate and adhesive material for best shear and peel strength, and balancing temperature compensation and stress absorption.

Paper Details

Date Published: 10 June 2004
PDF: 10 pages
Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); doi: 10.1117/12.527654
Show Author Affiliations
Christine Luo, Alliance Fiber Optic Products, Inc. (United States)
Daoyi Wang, Alliance Fiber Optic Products, Inc. (United States)
John Kong, Alliance Fiber Optic Products, Inc. (United States)
Lingzhi Li, Alliance Fiber Optic Products, Inc. (United States)
Jing Li, Alliance Fiber Optic Products, Inc. (United States)
Andrew Chang, Alliance Fiber Optic Products, Inc. (United States)
Yao Li, Alliance Fiber Optic Products, Inc. (United States)
Wei-shin Tsay, Alliance Fiber Optic Products, Inc. (United States)

Published in SPIE Proceedings Vol. 5358:
Photonics Packaging and Integration IV
Randy A. Heyler; Ray T. Chen, Editor(s)

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