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Proceedings Paper

Fiber-to-waveguide evanescent coupler for planar integration of silicon optoelectronic devices
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Paper Abstract

We present a method for coupling from a single mode fiber, or fiber ribbon, into an SOI waveguide for integration with silicon opto-electronic circuits. The coupler incorporates the advantages of the tapered waveguides and prism couplers, yet offers the flexibility of planar integration. The coupler can be fabricated on a double polished silicon wafer using direct polishing or grayscale photolithography. Tapered waveguides or J-couplers are then used as lateral mode converters. An experimental setup with a rotational stage and a pneumatic plunger has been built for adjusting the incident angle and tunnel layer thickness, which are key factors in determining the coupling efficiency. When optimal coupling is achieved on the setup, the coupler can be packaged using epoxy bonding. Thus, a fiber-waveguide parallel coupler or connector can be easily constructed. Electromagnetic calculation predicts a coupling efficiency of 77%(-1.14dB insertion loss) for a silicon-to-silicon coupler with a uniform tunnel layer. The coupling efficiency is experimentally achieved to be 46%(-3.4dB insertion loss) excluding the loss in silicon and the reflections from the input surface and output facet.

Paper Details

Date Published: 10 June 2004
PDF: 9 pages
Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004); doi: 10.1117/12.526627
Show Author Affiliations
Zhaolin Lu, Univ. of Delaware (United States)
Peng Yao, Univ. of Delaware (United States)
Sriram Venkataraman, Univ. of Delaware (United States)
David Pustai, Univ. of Delaware (United States)
Chunchen Lin, Univ. of Delaware (United States)
Garrett Schneider, Univ. of Delaware (United States)
Janusz Murakowski, Univ. of Delaware (United States)
Shouyuan Shi, Univ. of Delaware (United States)
Dennis W. Prather, Univ. of Delaware (United States)


Published in SPIE Proceedings Vol. 5358:
Photonics Packaging and Integration IV
Randy A. Heyler; Ray T. Chen, Editor(s)

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