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Proceedings Paper

Automated full-field interferometric characterization of micromachined silicon membrane
Author(s): Lei Xu; Xiaoyuan Peng; Jianmin Miao; Anand K. Asundi
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Paper Abstract

Among the current commercial micromachined devices, pressure sensors are by far the most successful and popular products. They work to sense the displacement-induced stresses of a silicon membrane with the thickness at the micro-scale. The miniature dimension of such devices, coupled with the demand of accurate deflection measurement for performance characterization, make suitable metrological tools in immediate need. In this paper, we present a digital micro-holo interferometric method for realizing highly sensitive measurement of the full-field displacement over the global test structure. Through the analysis on the system principles, the pressure-induced membrane deflection are accurately measured, and further determination of strain and stress is accomplished based on the verified FE model. From the obtained stress-pressure relation, the sensitivity of the pressure sensor is thus characterized.

Paper Details

Date Published: 23 December 2003
PDF: 8 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.524977
Show Author Affiliations
Lei Xu, Nanyang Technological Univ. (Singapore)
Xiaoyuan Peng, Nanyang Technological Univ. (Singapore)
Jianmin Miao, Nanyang Technological Univ. (Singapore)
Anand K. Asundi, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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