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Proceedings Paper

Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror
Author(s): Alexander Wolter; Harald Schenk; Hilmar Korth; Hubert Lakner
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Paper Abstract

Special micro scanning mirrors have been designed for the investigation of torsional stress in micro-scale hinges made of crystalline silicon. The setup with precise logging of resonant frequency and deflection amplitude of the MEMS-scanners is described. First results on fatigue and fracture strength are presented. Fracture of torsion beams with 6.6 μm x 30 μm cross-section occurred at 2.0 GPa to 2.4 GPa. No sign of fatigue was observed in operation for 512 h at 1.4 GPa torsional stress in resonance at 2260.7 Hz oscillation frequency. Measured frequency variation was 0.06% without any trend.

Paper Details

Date Published: 23 December 2003
PDF: 10 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.524872
Show Author Affiliations
Alexander Wolter, Fraunhofer-Institut fuer Photonische Mikrosysteme (Germany)
Harald Schenk, Fraunhofer-Institut fuer Photonische Mikrosysteme (Germany)
Hilmar Korth, Fraunhofer-Institut fuer Photonische Mikrosysteme (Germany)
Hubert Lakner, Fraunhofer-Institut fuer Photonische Mikrosysteme (Germany)

Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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