Share Email Print
cover

Proceedings Paper

Modeling and simulation of fiber image guide multichip modules for MOEMS applications
Author(s): Steven P. Levitan; Timothy P Kurzweg; Jose A Martinez; Mark A Kahrs; Jason Bakos; Craig Windish; Jason Boles; John Hansson; Michael Weisser; Charles Kuznia; Donald M. Chiarulli
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

Densely integrated systems in the future will incorporate device and communication technologies that span the domains of digital and analog electronics, optics, micro-mechanics, and micro-fluidics. Given the fundamental differences in substrate materials, feature scale and processing requirements between integrated devices in these domains, it is likely that multi-chip, system-in-package, integration solutions will be required for the foreseeable future. The multi-domain nature of these systems necessitates design tools that span multiple energy domains, time and length scales, as well as abstraction levels. This paper describes a case study of the modeling of a photonic/multi-technology system based on a 3D volumetric packaging technology implemented with Fiber Image Guide (FIG) based technology. It is 64x64 fiber crossbar switch implementation using three Silicon-on-Sapphire mixed signal switch die with flip-chip bonded VCSEL and detector arrays. We show a single end-to-end system simulation of the O/E crossbar working across the domains of free-space and guided wave optical propagation, GaAs O/E and E/O devices, analog drivers and receivers and integrated digital control.

Paper Details

Date Published: 24 January 2004
PDF: 10 pages
Proc. SPIE 5346, MOEMS and Miniaturized Systems IV, (24 January 2004); doi: 10.1117/12.524853
Show Author Affiliations
Steven P. Levitan, Univ. of Pittsburgh (United States)
Timothy P Kurzweg, Drexel Univ. (United States)
Jose A Martinez, Univ. of Pittsburgh (United States)
Mark A Kahrs, Univ. of Pittsburgh (United States)
Jason Bakos, Univ. of Pittsburgh (United States)
Craig Windish, Univ. of Pittsburgh (United States)
Jason Boles, Univ. of Pittsburgh (United States)
John Hansson, Schott Corp. (United States)
Michael Weisser, Schott Corp. (United States)
Charles Kuznia, Peregrine Semiconductors Corp. (United States)
Donald M. Chiarulli, Univ. of Pittsburgh (United States)


Published in SPIE Proceedings Vol. 5346:
MOEMS and Miniaturized Systems IV
Ayman El-Fatatry, Editor(s)

© SPIE. Terms of Use
Back to Top