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Proceedings Paper

Tether and joint design for microcomponents used in microassembly of 3D microstructures
Author(s): Nikolai Dechev; William L. Cleghorn; James K. Mills
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Paper Abstract

A novel microassembly system has been developed to assemble surface micromachined micro-parts, into 3D microstructures. This work describes the tether and joint design of micro-parts used in the microassembly process. The process consists of (a) grasping a micro-part which is tethered to the substrate of a chip, (b) removing the micro-part from the substrate by breaking the tethers, (c) manipulating the micro-part from its original location of fabrication to the target assembly location, and (d) joining the micro-part to another micro-part. In this way, out-of-plane or in-plane microstructures can be assembled from a set of initially planar micro-parts. The tether design is an integral part of the grasping and removal process. The tethers provide restraint on the micro-parts while they are grasped by a passive, compliant microgripper, and are designed to break-away at pre-defined locations, after the grasping process. In addition, the tethers ensure that the micro-parts do not translate or rotate from their fabricated and released positions, during transportation of the carrier chip. The joint system used to join micro-parts together is called "snap-lock’ microassembly. It is based on the elastic deflection of a plug feature that forms an interference fit with a mating slot feature.

Paper Details

Date Published: 24 January 2004
PDF: 13 pages
Proc. SPIE 5344, MEMS/MOEMS Components and Their Applications, (24 January 2004); doi: 10.1117/12.524685
Show Author Affiliations
Nikolai Dechev, Univ. of Toronto (Canada)
William L. Cleghorn, Univ. of Toronto (Canada)
James K. Mills, Univ. of Toronto (Canada)


Published in SPIE Proceedings Vol. 5344:
MEMS/MOEMS Components and Their Applications
Siegfried W. Janson; Albert K. Henning, Editor(s)

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