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Proceedings Paper

Factors affecting silicon membrane burst strength
Author(s): Albert K. Henning; Sapna Patel; Michael Selser; Bradford A. Cozad
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Paper Abstract

Factors affecting the fracture strength of single-crystal silicon membranes are assessed. These factors include: membrane shape at the membrane’s intersection with structural frames or sidewalls, membrane thickness, membrane surface roughness, membrane mis-orientation to the principal crystallographic axes, wafer starting material quality, membrane stress (or pre-tension), and microstructure and shape at bond interfaces, such as the anodic bond interface between membrane and Pyrex wafers. Measurements of fracture strength versus these factors are made. Direct measurements of stress are also made using micro-Raman techniques. Simulations of membrane structures are studied, in order to evaluate the measurements. The results indicate that the predominant factor affecting fracture strength is surface roughness.

Paper Details

Date Published: 23 December 2003
PDF: 9 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.524648
Show Author Affiliations
Albert K. Henning, Redwood Microsystems, Inc. (United States)
Sapna Patel, Redwood Microsystems, Inc. (United States)
Michael Selser, Redwood Microsystems, Inc. (United States)
Bradford A. Cozad, Redwood Microsystems, Inc. (United States)


Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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