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Proceedings Paper

BCB wafer bonding for microfluidics
Author(s): Taejoo Hwang; Dan Popa; Jeongsik Sin; Harry E. Stephanou; Eric M. Leonard
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Paper Abstract

In this paper we show that BCB wafer bonding, combined with deep-reactive-ion-etching (DRIE) for silicon, and HF etching for FOTURAN glass are viable methods to fabricate three-dimensional microfluidics. The BCB film is patterned by dry-etching technique with a photoresist mask and the target wafer is then bulk-micromachined together with the BCB mask. The two micromachined wafers are then bonded together under vacuum or nitrogen gas environment, at low temperature. Silicon-glass, silicon-silicon and glass-glass are all possible bonding pairs using thermocompressive bonding with BCB. It was found that hard-cured BCB bonding is more suitable for microfluidic channel fabrications than soft-cured BCB bonding, due to adhesive overflows in microfluidic channels and delamination during wet etching.

Paper Details

Date Published: 30 December 2003
PDF: 10 pages
Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); doi: 10.1117/12.524621
Show Author Affiliations
Taejoo Hwang, Rensselaer Polytechnic Institute (United States)
Dan Popa, Rensselaer Polytechnic Institute (United States)
Jeongsik Sin, Rensselaer Polytechnic Institute (United States)
Harry E. Stephanou, Rensselaer Polytechnic Institute (United States)
Eric M. Leonard, Eastman Kodak Co. (United States)


Published in SPIE Proceedings Vol. 5342:
Micromachining and Microfabrication Process Technology IX
Mary Ann Maher; Jerome F. Jakubczak, Editor(s)

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