Share Email Print
cover

Proceedings Paper

Investigation of improving MEMS-type VOA reliability
Author(s): Seok Kee Hong; Yeong Gyu Lee; Moo Youn Park
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

MEMS technologies have been applied to a lot of areas, such as optical communications, Gyroscopes and Bio-medical components and so on. In terms of the applications in the optical communication field, MEMS technologies are essential, especially, in multi dimensional optical switches and Variable Optical Attenuators(VOAs). This paper describes the process for the development of MEMS type VOAs with good optical performance and improved reliability. Generally, MEMS VOAs have been fabricated by silicon micro-machining process, precise fibre alignment and sophisticated packaging process. Because, it is composed of many structures with various materials, it is difficult to make devices reliable. We have developed MEMS type VOSs with many failure mode considerations (FMEA: Failure Mode Effect Analysis) in the initial design step, predicted critical failure factors and revised the design, and confirmed the reliability by preliminary test. These predicted failure factors were moisture, bonding strength of the wire, which wired between the MEMS chip and TO-CAN and instability of supplied signals. Statistical quality control tools (ANOVA, T-test and so on) were used to control these potential failure factors and produce optimum manufacturing conditions. To sum up, we have successfully developed reliable MEMS type VOAs with good optical performances by controlling potential failure factors and using statistical quality control tools. As a result, developed VOAs passed international reliability standards (Telcodia GR-1221-CORE).

Paper Details

Date Published: 23 December 2003
PDF: 6 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.524609
Show Author Affiliations
Seok Kee Hong, Samsung Electro-Mechanics Co., Ltd. (South Korea)
Yeong Gyu Lee, Samsung Electro-Mechanics Co., Ltd. (South Korea)
Moo Youn Park, Samsung Electro-Mechanics Co., Ltd. (South Korea)


Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

© SPIE. Terms of Use
Back to Top