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Proceedings Paper

Low-stressed high-aspect-ratio ultrathick SU-8 UV-LIGA process for the fabrication of a micro heat exchanger
Author(s): Bo Li; Quanfang Chen
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Paper Abstract

SU-8 is an ultra-thick negative photoresist with low optical absorption in the near UV range, which makes it an ideal material for generating thick molds for electroforming as well as a structural material for MEMS devices. However, the MEMS fabrication of using SU-8 is largely limited by its well-known poor adhesion to metallic layers as well as the high internal stress induced after baking. In this paper, an optimized process for fabricating ultra-thick low stressed SU-8 mold is developed and good adhesion between SU-8 and metals is obtained by applying a newly developed material, Omnicoat from Microchem Inc. A laminated (sandwiched) micro heat exchanger has been fabricated using the developed process in which sandwiched microchannels (one layer of Ni and one layer of SU-8) has been fabricated using the patterned SU-8 and nickel electroforming process. Test results show that the micro structure fabricated can stand at cryo temperature (77K) without damages such as cracks or delamination.

Paper Details

Date Published: 24 January 2004
PDF: 8 pages
Proc. SPIE 5344, MEMS/MOEMS Components and Their Applications, (24 January 2004); doi: 10.1117/12.524608
Show Author Affiliations
Bo Li, Univ. of Central Florida (United States)
Quanfang Chen, Univ. of Central Florida (United States)


Published in SPIE Proceedings Vol. 5344:
MEMS/MOEMS Components and Their Applications
Siegfried W. Janson; Albert K. Henning, Editor(s)

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