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Proceedings Paper

Heidi: a comprehensive micromirror test and characterization system with front and back side wafer probing
Author(s): Jefferson E Odhner; Matt Lockwood; Ajay Pareek; Cliff Fung
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Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, ; doi: 10.1117/12.524559
Show Author Affiliations
Jefferson E Odhner, Corning Intellisense Corp. (United States)
Matt Lockwood, Corning Intellisense Corp. (United States)
Ajay Pareek, Corning Intellisense Corp. (United States)
Cliff Fung, Corning Intellisense Corp. (United States)


Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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