Share Email Print
cover

Proceedings Paper

Wall shear stress and pressure sensor development for active control of flow
Author(s): Dimitrios M. Tsamados; Delphine Meunier; Mourad Laghrouche; Jumana Boussey; Sedat F. Tardu
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

In this paper we present a technology for wall shear stress and pressure integrated sensor fabrication. Thanks to the use of SOI wafers and wafer bonding technique, we came up with an innovative technology that provides high on-chip density of sensors required for arrays utilized in numerous microfluidic applications like active control of flow. At the end some wall shear stress results are presented.

Paper Details

Date Published: 30 December 2003
PDF: 10 pages
Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); doi: 10.1117/12.524533
Show Author Affiliations
Dimitrios M. Tsamados, Institut de Microelectronique, d'EPlectromagnetisme, et de Photonique (France)
Delphine Meunier, Institut de Microelectronique, d'EPlectromagnetisme, et de Photonique (France)
Mourad Laghrouche, IMEP (France)
Jumana Boussey, Institut de Microelectronique, d'EPlectromagnetisme, et de Photonique (France)
Sedat F. Tardu, Lab. des Ecoulements Geophysics et Industriels (France)


Published in SPIE Proceedings Vol. 5342:
Micromachining and Microfabrication Process Technology IX
Mary Ann Maher; Jerome F. Jakubczak, Editor(s)

© SPIE. Terms of Use
Back to Top