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Proceedings Paper

Improvement in reliability of MEMS resonator using multi-layers
Author(s): Prakash R. Apte; Priyadarshan U Patankar; Nilesh S Birari
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Paper Abstract

Many promising applications of MEMS based devices are in critical systems. Hence, their reliability has become an important issue. The techniques used for the fabrication of these devices give rise to large residual stresses. This coupled with their high speeds of operation make them prone to fatigue failure. The focus of this work is the improvement of reliability under fatigue loading using multi-layers. This paper demonstrates that by adjusting the thickness ratios, the stress in a multi-layered resonator can be prevented from alternating. Moreover, the peak stress can be minimized and performance can be improved in harsh environments.

Paper Details

Date Published: 23 December 2003
PDF: 6 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.524442
Show Author Affiliations
Prakash R. Apte, Indian Institute of Technology/Bombay (India)
Priyadarshan U Patankar, Indian Institute of Technology/Bombay (India)
Nilesh S Birari, Indian Institute of Technology/Bombay (India)

Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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