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Proceedings Paper

Development of an all-metal electrothermal actuator and its applications
Author(s): JiKui Luo; Johnny Han He; Andrew J. Flewitt; David F. Moore; S. Mark Spearing; Norman A. Fleck; Williams I. Milne
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Paper Abstract

The in-plane motion of microelectrothermal actuator ("heatuator") has been analysed for Si-based and metallic devices. It was found that the lateral deflection of a heatuator made of a Ni-metal is about ~60% larger than that of a Si-based actuator under the same power consumption. Metals are much better for thermal actuators as they provide a relatively large deflection and large force, for a low operating temperature, and power consumption. Electroplated Ni films were used to fabricate heatuators. The electrical and mechanical properties of electroplated Ni thin films have been investigated as a function of temperature and plating current density, and the process conditions have been optimised to obtain stress-free films suitable for MEMS applications. Lateral thermal actuators have been successfully fabricated, and electrically tested. Microswitches and microtweezers utilising the heatuator have also been fabricated and tested.

Paper Details

Date Published: 24 January 2004
PDF: 10 pages
Proc. SPIE 5344, MEMS/MOEMS Components and Their Applications, (24 January 2004); doi: 10.1117/12.524098
Show Author Affiliations
JiKui Luo, Univ. of Cambridge (United Kingdom)
Johnny Han He, Univ. of Cambridge (United Kingdom)
Andrew J. Flewitt, Univ. of Cambridge (United Kingdom)
David F. Moore, Univ. of Cambridge (United Kingdom)
S. Mark Spearing, Massachusetts Institute of Technology (United States)
Norman A. Fleck, Univ. of Cambridge (United Kingdom)
Williams I. Milne, Univ. of Cambridge (United Kingdom)

Published in SPIE Proceedings Vol. 5344:
MEMS/MOEMS Components and Their Applications
Siegfried W. Janson; Albert K. Henning, Editor(s)

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