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Proceedings Paper

Planar distortion quantification to evaluate PDMS stamps affixed on glass support
Author(s): Quanguo He; Zhengchun Liu; Jianxin Tang ; Libo Nie; Hong Xiang; Hong Chen; Pengfeng Xiao; Nongyue He
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Paper Abstract

This article describes a planar distortion quantification method for PDMS stamps used in soft lithography by introducing an angular parameter θ; the distortion θ is proportional to planar distortion in magnitude. We employ this method to evaluate PDMS stamps planar distortions supported on different treated glass with Micron XYZ Scope measurements. The average planar distortion of individual pattern (absolute distortion θ1) and their pattern-to-pattern distortion (relative distortion θ2) of PDMS stamps were determined by angular discrepancies (θ). The planar distortion quantification was evaluated among four different PDMS stamps affixation treatments, and the PDMS stamps supported on silane-modified glass showed strong binding and minimal planar distortion, its absolute angular distortion θ1 was 3.98x10-3 and relative angular distortion θ2 1.22x10-3. Such distortion quantification agreed with the results of linear and area shrinkages on the stamps surface patterns, the results showed high reliability and fidelity of PDMS stamps and similar elastomer micro-patterns supported on silane-modified glass by photo lithographic microfabrication method and their promising prospects for on-chip synthesis of DNA microarray and bio-devices fabrication in soft lithography. The distortion evaluations demonstrate a versatile method for quantifying and comparing planar distortions among patterns as well as screening elastomer stamps support in soft lithography.

Paper Details

Date Published: 23 December 2003
PDF: 8 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.523899
Show Author Affiliations
Quanguo He, Zhuzhou Institute of Technology (China)
Southeast Univ. (China)
Zhengchun Liu, Zhuzhou Institute of Technology (China)
Southeast Univ. (China)
Jianxin Tang , Zhuzhou Institute of Technology (China)
Libo Nie, Zhuzhou Institute of Technology (China)
Hong Xiang, Zhuzhou Institute of Technology (China)
Hong Chen, Zhuzhou Institute of Technology (China)
Pengfeng Xiao, Southeast Univ. (China)
Nongyue He, Zhuzhou Institute of Technology (China)


Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

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