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Proceedings Paper

Magnetothermoelectrical and adhesive properties of commutation contacts of thermoelements on the basis of extruded samples of Bi85Sb15 solid solution
Author(s): M. M. Tagiyev
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Paper Abstract

A study of electrical and adhesive properties of transient contacts for extruded samples of Bi85Sb15 solid solutions have been conducted with alloys: 25Bi + 50Pb + 12.5Cd + 12.5Sn with Tm = 343 K (Wood"s alloy) and 57Bi + 45Sn with Tm =412 K in temperature range ~77-300 K and magnetic field intensity (H) up to ~74x104 A/m. It is shown that resistance of transient contacts (rk) of the extruded of Bi85Sb15 solid solution with the specified contact alloys at ~77K is determined by the resistance of the structure the solid solution Bi85Sb15-solid solution Bi85Sb15, heavily doped by Pb and Sn atoms, diffused from contact alloy into near-contact area of the Bi85Sb15 solid solution. It is established, that by doping extruded samples of Bi85Sb15 solid solution with Pb atoms it is possible to achieve reduction of a transient contact resistance rk in Bi85Sb15 solid solution - contact alloy interface.

Paper Details

Date Published: 30 September 2003
PDF: 3 pages
Proc. SPIE 5126, 17th International Conference on Photoelectronics and Night Vision Devices, (30 September 2003); doi: 10.1117/12.523890
Show Author Affiliations
M. M. Tagiyev, Institute of Photoelectronics ANAS (Azerbaijan)


Published in SPIE Proceedings Vol. 5126:
17th International Conference on Photoelectronics and Night Vision Devices

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