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Proceedings Paper

Finite element simulations of stacked crystal filters
Author(s): Jiunn-Horng Lee; Kung-Yu Tzeng; Chih-Wei Cheng; Yu-Ching Shih; Chih-Min Yao
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Paper Abstract

Wireless networks are growing rapidly. Their applications include cellular phone, satellite communication and wireless local area networks. In order to avoid interference between all these applications, high selectivity RF filters are essential. The stacked crystal filter (SCF) is a useful configuration when low insertion loss is desired and the near-in skirt selectivity requirement is not as high as that produced by ladder filters. A SCF is an acoustically coupled resonator filter which includes a pair of thickness mode piezoelectric plates attached to each other. Mounted between adjacent sides of the two plates is a shared electrode. The common ways to model the SCF are mason model and lumped element equivalent circuit method. To accommodate complicated geometries, we need to use the other kinds of numerical analysis techniques. Finite element methods have been applied to the modeling of thin film bulk acoustic wave resonator in recent years. Advanced FEM software has the capability to do a coupled piezoelectric-circuit analysis that can connect electrical circuits directly to the piezoelectric finite element models. In this work, we integrate the SCF two-dimensional piezoelectric finite element models and electrical circuits together to simulate the performance of SCF. The influences of electrode property and acoustic loss to the performance of filter are also investigated. The results of simulation are verified by mason model. This methodology can be applied to more complicated geometry models and other types of filters simulation such as coupled resonator filters (CRF) and ladder filters.

Paper Details

Date Published: 30 March 2004
PDF: 7 pages
Proc. SPIE 5274, Microelectronics: Design, Technology, and Packaging, (30 March 2004); doi: 10.1117/12.522915
Show Author Affiliations
Jiunn-Horng Lee, National Ctr. for High-Performance Computing (Taiwan)
Kung-Yu Tzeng, National Ctr. for High-Performance Computing (Taiwan)
Chih-Wei Cheng, National Ctr. for High-Performance Computing (Taiwan)
Yu-Ching Shih, National Ctr. for High-Performance Computing (Taiwan)
Chih-Min Yao, National Ctr. for High-Performance Computing (Taiwan)


Published in SPIE Proceedings Vol. 5274:
Microelectronics: Design, Technology, and Packaging
Derek Abbott; Kamran Eshraghian; Charles A. Musca; Dimitris Pavlidis; Neil Weste, Editor(s)

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