Share Email Print
cover

Proceedings Paper

Wafer-level scale package of MEMS device by eutectic bonding method
Author(s): Sihai Chen; Hong Ma; Mingxiang Chen; Tao Xiong; Sheng Liu; Xinjian Yi
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

This paper reports the preliminary results for an on-going program in wafer-level MEMS package. In this particular paper, three closed-loop microheaters of 5μm, 7μm and 9μm width were designed. By reactive ion sputtering technique, two classes of samples were presented. The first one was first co-sputtered with nickel / chromium (Ni/Cr) alloy and then sputtered with gold(Au) metal as heating material; the second one was sputtered with Cr, tin (Sn) and Au respectively as heating material. The bonding of the former sample based on the Ni/Cr and Au heating material failed. The eutectic bonding experiment of the later sample based on the Cr, Sn and Au heating material by global heating method was completed in annealing oven at temperature of about 400 deg. C. for 20 minutes. The SEM testing result showed the eutectic bonding of Au-Sn by global heating was successful. More results will be reported in future.

Paper Details

Date Published: 23 December 2003
PDF: 7 pages
Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.522834
Show Author Affiliations
Sihai Chen, Huazhong Univ. of Science and Technology (China)
Hong Ma, Huazhong Univ. of Science and Technology (China)
Mingxiang Chen, Huazhong Univ. of Science and Technology (China)
Tao Xiong, Huazhong Univ. of Science and Technology (China)
Sheng Liu, Huazhong Univ. of Science and Technology (China)
Xinjian Yi, Huazhong Univ. of Science and Technology (China)


Published in SPIE Proceedings Vol. 5343:
Reliability, Testing, and Characterization of MEMS/MOEMS III
Danelle M. Tanner; Rajeshuni Ramesham, Editor(s)

© SPIE. Terms of Use
Back to Top