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Proceedings Paper

Shape measurement of BGA for analysis of defects by x-ray imaging
Author(s): Tetsuhiro Sumimoto; T. Maruyama; Yoshiharu Azuma; Sachiko Goto; M. Mondou; N. Furukawa; Saburo Okada
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Paper Abstract

This paper deals with the development of image analysis for the detection of defects at BGA solder joints in PC boards by using X-ray imaging. We can't detect visually defects at BGA solder joints, because they are hidden under the IC package. To improve a cost performance and the reliability of PC boards, an inspection of BGA is required in the surface mount process. Types of defects at BGA solder joints are solder bridge, missing connection, solder voids, open connection and miss-registration of parts. As we can find mostly solder bridge in these defects, we pick up this to detect solder bridge in a production line. The problems of image analysis for the detection of defects at BGA solder joints are the detection accuracy and image processing time according to a line speed of production. To get design data for the development of the inspection system, which can be used easily in the surface mount process, it is important to develop image analysis techniques based on X-ray image data. At the first step of our study, we attempt to measure the shape of BGA based on X-ray imaging.

Paper Details

Date Published: 2 September 2003
PDF: 5 pages
Proc. SPIE 5253, Fifth International Symposium on Instrumentation and Control Technology, (2 September 2003); doi: 10.1117/12.521903
Show Author Affiliations
Tetsuhiro Sumimoto, Okayama Univ. Medical School (Japan)
T. Maruyama, Okayama Univ. Medical School (Japan)
Yoshiharu Azuma, Okayama Univ. Medical School (Japan)
Sachiko Goto, Okayama Univ. Medical School (Japan)
M. Mondou, Eastern Hiroshima Prefecture Industrial Research Institute (Japan)
N. Furukawa, National Institute of Advanced Industrial Science and Technology (Japan)
Saburo Okada, National Institute of Advanced Industrial Science and Technology (Japan)


Published in SPIE Proceedings Vol. 5253:
Fifth International Symposium on Instrumentation and Control Technology
Guangjun Zhang; Huijie Zhao; Zhongyu Wang, Editor(s)

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