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Proceedings Paper

CAD/CAM for MEMS and BioMEMS
Author(s): Brian Hargrave; Bryan Irwin; Robert Parkhill; Kenneth H Church; Michael N. Nguyen; Anatoly Kachurin; William L Warren
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Paper Abstract

Novel devices can be relatively simple in theory and modeling, but difficult and many times unfeasible to fabricate in a traditional cleanroom environment. We have developed a CAD/CAM tool capable of integrating multiple materials in the electronic, photonic, and biological regimes for applications in both MEMS and BioMEMS devices. Some materials are known and more fully characterized, such as thick film resistors or conductors, while other materials such as biodegradable scaffolding are new but showing promise to realize heterogenous tissue engineered constructs and drug delivery devices. The tool does not discriminate, but rather places these materials in specified locations with precision volumetric control, gently, conformally, and in 3-D. This paper will describe the enabling aspect of true 3-D maskless fabrication as well as describe multiple device structures and demonstrations.

Paper Details

Date Published: 29 July 2004
PDF: 12 pages
Proc. SPIE 5389, Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology, (29 July 2004); doi: 10.1117/12.521503
Show Author Affiliations
Brian Hargrave, nScrypt, LLC (United States)
Bryan Irwin, nScrypt, LLC (United States)
Robert Parkhill, nScrypt, LLC (United States)
Kenneth H Church, nScrypt, LLC (United States)
Michael N. Nguyen, BioAssembly, LLC (United States)
Anatoly Kachurin, BioAssembly, LLC (United States)
William L Warren, BioAssembly, LLC (United States)


Published in SPIE Proceedings Vol. 5389:
Smart Structures and Materials 2004: Smart Electronics, MEMS, BioMEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

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