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Proceedings Paper

Large-area definition of nano-electrodes by nanoimprint lithography
Author(s): Matthias Wissen; Hella-Christin Scheer; Hubert Schulz; J. T. Horstmann; M. Scherff; Wolfgang R. Fahrner
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Paper Abstract

Sidewall lithography was used as a low cost fabrication process for high aspect ratio stamps for hot embossing. The stamps, featuring up to 1 μm pattern height and an aspect ratio of about 5:1 were tested in a typical hot embossing process at 50 bar. Mechanical stability of the crystalline stamp structures was achieved after optimization of the respective dry etch process. At imprint temperatures of 140°C PMMA was imprinted over areas of four inch diameter. After residual layer removal in the trenches Al electrodes of 500 nm height and 200 nm width could be defined by evaporation and lift off.

Paper Details

Date Published: 2 September 2003
PDF: 8 pages
Proc. SPIE 5253, Fifth International Symposium on Instrumentation and Control Technology, (2 September 2003); doi: 10.1117/12.521470
Show Author Affiliations
Matthias Wissen, Univ. of Wuppertal (Germany)
Hella-Christin Scheer, Univ. of Wuppertal (Germany)
Hubert Schulz, Univ. of Wuppertal (Germany)
J. T. Horstmann, Univ. of Dortmund (Germany)
M. Scherff, Univ. of Hagen (Germany)
Wolfgang R. Fahrner, Univ. of Hagen (Germany)


Published in SPIE Proceedings Vol. 5253:
Fifth International Symposium on Instrumentation and Control Technology
Guangjun Zhang; Huijie Zhao; Zhongyu Wang, Editor(s)

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