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Proceedings Paper

Simulation of silicon micromachined ultrasonic transducers
Author(s): Li-Feng Ge
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Paper Abstract

A general 3-D TDK model developed further in this paper has been successfully applied to simulate a surface micromachined electrostatic or capacitive ultrasonic transducer with vacuum-sealed air-cavities (i.e. cMUT). Also, the paper gives a reliable prediction of resonant and anti-resonant frequencies of a typical cMUT.

Paper Details

Date Published: 2 September 2003
PDF: 4 pages
Proc. SPIE 5253, Fifth International Symposium on Instrumentation and Control Technology, (2 September 2003); doi: 10.1117/12.521356
Show Author Affiliations
Li-Feng Ge, Anhui Univ. (China)


Published in SPIE Proceedings Vol. 5253:
Fifth International Symposium on Instrumentation and Control Technology
Guangjun Zhang; Huijie Zhao; Zhongyu Wang, Editor(s)

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