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Proceedings Paper

High-resolution reticle inspection technique providing a complete reticle qualification solution in advanced 90-nm node wafer fabs
Author(s): Louie Liu; Chi-Horng Liao; Yi-Ming Dai; Jyh-Ching Lin; Kaustuve Bhattacharyya; Yao-Tsu Huang; Kong Son; Den Wang
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Paper Abstract

High-resolution contamination inspection for advanced reticles remains crucial in light of the increasing trend of progressive defects such as crystal growth, etc., introduced with DUV lithography, especially for low k1 processes. In most fab environments, routine incoming and re-qualification inspections for photomasks have been implemented. But although this high-resolution inspection provides necessary high-sensitivity, on advanced photomasks it often introduces inspection challenges. Aggressive OPCs and dense primary and secondary geometries are some of the many factors that can result in false-defect problems for the inspection systems. Thus, inspection needs to be desensitized. As an effort to identify a methodology to provide the inspectability while maintaining the necessary high-sensitivity, a characterization has been performed to evaluate a new combination- mode inspection. This technical paper will list the details of this special contamination inspection technique that will allow users to maintain the same high inspection throughput while providing similar or higher resolution inspection for these advanced reticles with superior inspectability.

Paper Details

Date Published: 17 December 2003
PDF: 9 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.518539
Show Author Affiliations
Louie Liu, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chi-Horng Liao, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Yi-Ming Dai, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Jyh-Ching Lin, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Kaustuve Bhattacharyya, KLA-Tencor Corp. (United States)
Yao-Tsu Huang, KLA-Tencor Corp. (United States)
Kong Son, KLA-Tencor Corp. (United States)
Den Wang, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)

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