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Proceedings Paper

ART structures: a wafer targeting system that relaxes the mean-to-target reticle specification
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Paper Abstract

High-speed production of semiconductor devices demands in-line wafer metrology on a minimum number of sample points. If this data does not represent the average chip feature size, then an in-line monitor may indicate that a wafer is right on target. However, at end-of-line testing, the electrical parameters, incorporating all features within the chip, may be found shifted away from target. This paper presents a solution which increases wafer critical dimension targeting efficiency while notably relaxing the traditional mean-to-target reticle specification. By embedding ART (Average Representative Targeting) Structures into the reticle scribe, Reticle Engineering at LSI Logic leverage off the ability to adjust wafer exposure dose to compensate for off target reticle CDs. The novel targeting structure described in this paper assures average wafer CDs within 2.5 nm of target while effectively doubling the acceptable range for a standard mean to target reticle specification.

Paper Details

Date Published: 17 December 2003
PDF: 6 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.518159
Show Author Affiliations
Robert Muller, LSI Logic Corp. (United States)
Mark Simmons, LSI Logic Corp. (United States)
Duane Barber, LSI Logic Corp. (United States)


Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)

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