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Proceedings Paper

Improved phase uniformity control using a new AAPSM etch stop layer technique
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Paper Abstract

One of the major challenges in alternating aperture phase shift mask (AAPSM) production is the variability of the glass etch rate as a function of exposed area (pattern loading) on the mask. The lack of an endpoint system means that the etch is entirely based on time, and the result is increased variability in the mean etch depth as well as decreased yields against ever tightening phase specifications. If a transmissive etch stop layer were placed underneath an appropriate thickness of glass to obtain a 180-degree phase shift, the result is a forced endpoint at exactly 180 degrees every time. Such a film system also leads to many process advantages over conventional AAPSM processes. This paper discusses the film stack deposition and maskmaking at Photronics, Inc. and details the process advantages of using AAPSM blanks with etch stop layers.

Paper Details

Date Published: 17 December 2003
PDF: 11 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.518130
Show Author Affiliations
Matthew Lassiter, Photronics, Inc. (United States)
Michael J. Cangemi, Photronics, Inc. (United States)
Darren Taylor, Photronics, Inc. (United States)


Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)

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