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Proceedings Paper

Phase degradation characteristics of programmed AAPSM defects with automatic inspection tool sensitivity
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Paper Abstract

Accurate defect characterization is becoming increasingly more important with the increased implementation of AAPSM applications. Quartz bump/divot defectivity adds a third dimension to the historical definition of photomask defects that included only size and transmission. This new dimension is phase. Past studies have suggested that significant phase degradation occurs even at smaller defect sizes. This characterization is tied closely with the defect capture capability of photomask inspection. Inspection tool sensitivity to phase defects is increasingly important for at least two reasons: the danger of catastrophic defects printing on the wafer, and the newness of these types of defects to the photomask-making community at large. This experiment utilizes two distinct forms of defect characterization -- SEM sizing and surface profilometry. Programmed defect test masks were manufactured for phase shifting properties at both 248nm and 193nm exposure wavelengths. The defects were etched at multiple depths resulting in a variety of phase angle errors. This study will examine the effects of phase degradation on smaller defects along with defect capture from automatic inspection tools.

Paper Details

Date Published: 17 December 2003
PDF: 6 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.518065
Show Author Affiliations
Darren Taylor, Photronics, Inc. (United States)
Eric Poortinga, Photronics, Inc. (United States)

Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)

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