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Proceedings Paper

Update on the EUVL mask blank activity at Schott Lithotec
Author(s): Frank Sobel; Lutz Aschke; Hans W. Becker; Markus Renno; Frauke Ruggeberg; Steffen Kirchner; Thomas Leutbecher; Nathalie Olschewski; Mario Schiffler; Kurt Walter; Guenter Hess; Ute Buttgereit; Konrad Knapp; Rainer Lebert; Larissa Juschkin; Christian Wies; Bernhard Jagle
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Paper Abstract

Schott Lithotec has introduced all relevant technology steps to manufacture EUV mask blanks in its advanced quality mask blank manufacturing line -- ranging from Low Thermal Expansion Material (LTEM) high quality substrate polishing to low defect blank manufacturing. New polishing and cleaning technologies, improved sputter technology and updated metrology enable us to produce EUVL mask blanks meeting already some of the roadmap requirements. Further R&D is ongoing to path the way to the pilot production of EUV blanks which meet the beta-specifications end of 2005. We present the status of our EUVL substrate program and report on the recent results of our activities for low defect multilayer, buffer and absorber coating including new absorber materials. Recent results from the production of full LTEM EUV blanks with multilayer, buffer and absorber coatings will be presented. Process steps in the EUVL mask blank fabrication in a production environment were characterized in terms of defects; the process improvement potential is discussed. We will also throw a light on the aspects of changed layer properties after a longer period of storage. In addition, special metrology methods for EUVL components are currently being developed within the program. The status of the high throughput EUV-Reflectometer for mask blanks will be presented. We developed new processes to achieve EUVL requirements.

Paper Details

Date Published: 17 December 2003
PDF: 12 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.518061
Show Author Affiliations
Frank Sobel, Schott Lithotec AG (Germany)
Lutz Aschke, Schott Lithotec AG (Germany)
Hans W. Becker, Schott Lithotec AG (Germany)
Markus Renno, Schott Lithotec AG (Germany)
Frauke Ruggeberg, Schott Lithotec AG (Germany)
Steffen Kirchner, Schott Lithotec AG (Germany)
Thomas Leutbecher, Schott Lithotec AG (Germany)
Nathalie Olschewski, Schott Lithotec AG (Germany)
Mario Schiffler, Schott Lithotec AG (Germany)
Kurt Walter, Schott Lithotec AG (Germany)
Guenter Hess, Schott Lithotec AG (Germany)
Ute Buttgereit, Schott Lithotec AG (Germany)
Konrad Knapp, Schott Lithotec AG (Germany)
Rainer Lebert, AIXUV GmbH (Germany)
Larissa Juschkin, AIXUV GmbH (Germany)
Christian Wies, AIXUV GmbH (Germany)
Bernhard Jagle, AIXUV GmbH (Germany)


Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)

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