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Proceedings Paper

Solving a layout design problem by analytic hierarchy process (AHP) and data envelopment analysis (DEA) approach
Author(s): Umut Rifat Tuzkaya; Arzum Eser; Goner Argon
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Paper Abstract

Today, growing amounts of waste due to fast consumption rate of products started an irreversible environmental pollution and damage. A considerable part of this waste is caused by packaging material. With the realization of this fact, various waste policies have taken important steps. Here we considered a firm, where waste Aluminum constitutes majority of raw materials for this fir0m. In order to achieve a profitable recycling process, plant layout should be well designed. In this study, we propose a two-step approach involving Analytic Hierarchy Process (AHP) and Data Envelopment Analysis (DEA) to solve facility layout design problems. A case example is considered to demonstrate the results achieved.

Paper Details

Date Published: 27 February 2004
PDF: 8 pages
Proc. SPIE 5262, Environmentally Conscious Manufacturing III, (27 February 2004); doi: 10.1117/12.518054
Show Author Affiliations
Umut Rifat Tuzkaya, Yildiz Technical Univ. (Turkey)
Arzum Eser, Yildiz Technical Univ. (Turkey)
Goner Argon, Northeastern Univ. (United States)


Published in SPIE Proceedings Vol. 5262:
Environmentally Conscious Manufacturing III
Surendra M. Gupta, Editor(s)

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