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Proceedings Paper

Study of dry etching pattern profile of chromeless phase lithography (CPL) mask
Author(s): Jimmy Lin; Michael Hsu; Tony Hsu; Stephen D. Hsu; Xuelong Shi; Douglas J. Van Den Broeke; J. Fung Chen; F. C. Tang; W. A. Hsieh; C. Y. Huang
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Paper Abstract

The chromeless phase lithography is a potential technology for low k1 optical image. Since the image quality is controlled by the phase interference, the phase error that results from mask processing becomes an issue. In the previous study, we have investigated the phase error effect and optimized the etching recipe by using the orthogonal DOE method. However, the 3D pattern profile is another critical factor, which affect the image intensity and needs to be clarified. In this paper, the through pitch L/S pattern with various profile angles were studied. Test patterns were measured, and verified by AFM, SEM, and metrology tools to get profile angles, phase values, and CD dimension. Simulation was used to predict the trend of process performance and analyze the impact on process control. The process windows for specific pattern profiles were also verified by wafer printing result. An optimized etching process and a set of spec recommendations for the CPL PSM was obtained.

Paper Details

Date Published: 17 December 2003
PDF: 8 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.518021
Show Author Affiliations
Jimmy Lin, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Michael Hsu, ASML MaskTools, Inc. (United States)
Tony Hsu, Toppan Chunghwa Electronics Co., Ltd. (Taiwan)
Stephen D. Hsu, ASML MaskTools, Inc. (United States)
Xuelong Shi, ASML MaskTools, Inc. (United States)
Douglas J. Van Den Broeke, ASML MaskTools, Inc. (United States)
J. Fung Chen, ASML MaskTools, Inc. (United States)
F. C. Tang, Winbond Electronics Corp. (Taiwan)
W. A. Hsieh, Winbond Electronics Corp. (Taiwan)
C. Y. Huang, Winbond Electronics Corp. (Taiwan)


Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)

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