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Proceedings Paper

Reticle inspection optimization for 90-nm and 130-nm technology nodes using a multibeam UV wavelength inspection tool
Author(s): Rick Lai; Luke Hsu; Chiun Hong Kung; Johnson Hung; Wei Hong Huang; Chue-San Yoo; Yao-Tsu Huang; Vincent Hsu
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Paper Abstract

As the lithography design rule of IC manufacturing industry migrates into sub-130nm nodes, low k1 factor prevails, the mask error enhancement factor (MEEF) increases. Low k1 processing calls for aggressive sub-resolution assist features and the use of attenuated phase shift masks (AttPSMs). The aggressive OPC features pose challenges to reticle inspection due to high false detection, which is time-consuming for defect classification and impacts the throughput of mask manufacturing. Moreover, the high transmission of the shifter material of 193 nm AttPSM also challenges the UV-based reticle inspection tools with high nuisance counts due to undesirable optical diffraction effects. For a given reticle inspection tool, it is necessary to calibrate the system contrast between the clear and opaque regions (quartz/chrome or quartz/MoSi) of the reticles. In this study, we present the influences of various calibration conditions on sensitivity, false and nuisance detection of reticle inspections. Both the STARlight contamination inspections and the die-to-die pattern inspections were carried out using the KLA-Tencor TeraStar inspection tools with production masks and programmed defect test masks including binary intensity masks (BIMs) and AttPSMs. Successful applications with low false detection and adapted sensitivity will be illustrated in terms of optimizing the calibration setup.

Paper Details

Date Published: 17 December 2003
PDF: 12 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.518016
Show Author Affiliations
Rick Lai, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Luke Hsu, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chiun Hong Kung, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Johnson Hung, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Wei Hong Huang, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chue-San Yoo, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Yao-Tsu Huang, KLA-Tencor Corp. (Taiwan)
Vincent Hsu, KLA-Tencor Corp. (Taiwan)

Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)

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