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Proceedings Paper

Shuttle mask floorplanning
Author(s): Gang Xu; Ruiqi Tian; Martin D.F. Wong; Alfred J. Reich
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Paper Abstract

A shuttle mask has different chips on the same mask. The chips are not electrically connected. Alliance and foundry customers can utilize shuttle masks to share the rising cost of mask and wafer manufacturing. This paper studies the shuttle mask floorplan problem, which is formulated as a rectangle-packing problem with constraints of final die sawing strategy and die-to-die mask inspection. For our formulation, we offer a "merging" method that reduces the problem to an unconstrained slicing floorplan problem. Excellent results are obtained from the experiment with real industry data. We also study a "general" method and discuss the reason why it does not work very well.

Paper Details

Date Published: 17 December 2003
PDF: 10 pages
Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); doi: 10.1117/12.517568
Show Author Affiliations
Gang Xu, Univ. of Texas/Austin (United States)
Ruiqi Tian, Motorola, Inc. (United States)
Martin D.F. Wong, Univ. of Illinois/Urbana-Champaign (United States)
Alfred J. Reich, Motorola, Inc. (United States)

Published in SPIE Proceedings Vol. 5256:
23rd Annual BACUS Symposium on Photomask Technology
Kurt R. Kimmel; Wolfgang Staud, Editor(s)

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